Hypertec 1GB PC2700 (Legacy) memory module 1 x 1 GB DDR 333 MHz DDR3 2 V Memory ranking 2

2 V Memory ranking 2 ECC Yes Memory clock speed 2133 MHz Internal memory type DDR4 Features Buffered memory type Registered (buffered) Backlight No Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Server Memory form factor 288-pin DIMM CAS latency 15 Memory voltage 1

A Hewlett Packard equivalent 4GB Unbuffered ECC DIMM (PC3-10600) from Hypertec

2 V Memory ranking 1 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Backlight No Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM Memory clock speed 2400 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM Memory clock speed 2400 MHz Internal memory type DDR4

Memory Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 204-pin SO-DIMM CAS latency 10 ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 204-pin SO-DIMM CAS latency 10 ECC No Memory clock speed 1600 MHz Internal memory type DDR3

Hypertec 1GB PC2700 (Legacy) memory module 1 x 1 GB DDR 333 MHz DDR3 2 V Memory ranking 2A Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to